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Product Descriptions
APEL Postforming Glue
APEL Postforming Glue is a water based PVAc. glue that is used to bond laminate papers to MDF or chipboards. It is also used for postforming applications and very suitable for high temperature applications. It is highly resistant to different sources of temperature and will not debond even in risky applications. It does corrose, get moldy or char and highly resistant to physical effects.
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